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BrandPost: Connecting Dies: How Moore’s Law Now Drives Packages

Were You Aware that processors, and different packaged integrated circuits, ceaselessly incorporate multiple die (aka chip)? It’s not something which you can tell BY USING taking a look at them. They Give The Impression Of Being the identical, but the insides are altering. Names such as “multi-chip modules” (MCM), “device in Bundle” (SIP), “3D stacking,” and “flip chips” have been used to explain this pattern of packing multiple dies in a Package. It’s changing into standard now.

intell image 1 Moshen, Pentiumpro moshen, CC WITH THE AID OF-SA 2.5

What’s inside of that Package Deal?

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